Thermal Conductive Materials

• Pads available in 0.5, 1.0, 1.5 and 2.0 mm
• Soft for good conformability even to non-flat integrated circuit (IC) surfaces and heat spreading blocks
• Little to no siloxane gas/oil bleeding that can cause electric connection failures
• High pressure relaxation helps reduce pressure to electric components
• Good electrical insulation properties
• Slight tack allows easy pre-assembly
• Good wetting performance for better thermal conductivity

• Good thermal stability of the base polymer with excellent softness of the thermal pad
• Good thermal conductivity in a ultra soft silicone polymer base
• The product tack is such that a mechanical means to support the pad in a final assembly is required
• Thin PET film, 12 micrometer, carrier supported on one side for good converting and handling properties

• Good softness and conformability to non-flat surfaces.
• Excellent compressive stress relaxation.
• High thermal conductivity.
• UL94 V-O certified (File No. E176845).
• Good surface tack leads to low thermal resistance at surface.
• Non-silicone acrylic elastomer.
• Good dielectric performance.
• Excellent durability for long term thermal conductivity and electric insulation stability.

• Good thermal stability of the base polymer with excellent softness of the thermal pad.
• Good thermal conductivity in a soft silicone polymer base.
• The product tack is such that a mechanical means to support the pad in a final assembly is required.
• This "S" version has a permanent PEN film, 9 micrometer thick, on one side to provide for a non-tacky surface, increased puncture resistance, ease of handling and rework.

• Good thermal stability of the base polymer with excellent softness of the thermal pad.
• Good thermal conductivity in a soft silicone polymer base
• The product tack is such that a mechanical means to support the pad in a final assembly is required