Specifications
| Attribute | Value |
|---|---|
| Product Type | Epoxy |
| Conductive Element | Silver |
| Package Type | Tube |
| Package Size | 0.25 oz |
| Cure Time | 24 h |
Features & Benefits
- Quick solderless electronic connections
- High strength conductive bonding
- Ideal for bonding surface mount connections, track repair, die attach, static discharge and grounding
- Bonds a wide variety of materials including solder alloys, aluminium, copper and glass
- Compatible with Circuit Works® Conductive and Overcoat pens
- Cure time: 24 Hrs @ 25°C
Product Application Information
- Designed to be used by professionals for electronic applications including
- Conductive bonds between heat-sensitive components
- Solderless surface mount connections
- Circuit board trace repairs
- Static discharge and grounding
- Solder repair
- Conductive structural adhesions
