Features :-
- Good Thermal conductivity (0.6W/m-K)
- Electrically insulating
- Low Thermal impedance
- Good & reliable adhesion performance for aluminum (AI) & steel use stainless (SUS)
- Vibration damping
- General heat sink bonding Â
- IC chip packaging heat conduction
- Â Printed circuit board
- Â LED module/board bonding
- Â Flat panel display assembly
- Â COF chip heat conduction















































